Multipath Routing in Cloud Computing using Fuzzy based Multi-Objective Optimization System in Autonomous Networks

Intelligent houses and buildings, autonomous automobiles, drones, robots, and other items that are successfully incorporated into daily life are examples of autonomous systems and the Internet of Things (IoT) that have advanced as research areas. Secured data transfer in untrusted cloud applications has been one of the most significant requirements in the cloud in recent times. In order to safeguard user data from unauthorised users, encrypted data is stored on cloud servers. Existing techniques offer either security or efficiency for data transformation. They fail to retain complete security while undergoing significant changes. This research proposes novel technique in multipath routing based energy optimization of autonomous networks. The main goal of this research is to enhance the secure data transmission in cloud computing with network energy optimization. The secure data transmission is carried out using multi-authentication attribute based encryption with multipath routing protocol. Then the network energy has been optimized using multi-objective fuzzy based reinforcement learning. The experimental analysis has been carried out based on secure data transmission and energy optimization of the network. The parameters analysed in terms of scalability of 79%, QoS of 75%, encryption time of 42%, latency of 96%, energy efficiency of 98%, end-end delay of 45%

FOLK MEDICINE AMONG TRIBE PEOPLE- A REVIEW

Today ancient Ayurvedic texts have been researched and a lot of hidden knowledge has been brought to surface light and Ayurveda is becoming one of the leading scientific way of preserving and promoting a healthy life. On the other-hand we do not know much about another type of medicine which is more ancient, equally efficacious and widely practised by its adherents: Folk medicines. Folk medicine was practised during Atharva-Vedic period and it is still practised in 21st century by tribal people, villagers and even by some people of cities who still adheres to their ancestor knowledge in India. Folk medicine has its own concept of causation of disease, diagnostic techniques and treatment. In history of Indian medicine little or almost no attention has been given to folk medicine, on the other-hand tribal and village people believe in folk medicine as it fits in with their culture and way of thinking. If we want that these people can derive benefit from Ayurveda or Modern medicine then we have to take pain to see that today’s medicine is presented to them in such a way that it is ‘acceptable’ to them. We can make it ‘acceptable’ only if we know what they believe in. So here effort was made to recollect knowledge about folk medicine in india so that it not remain patchy and inadequate and helps to promote healthy life

Competition between antiferromagnetism and superconductivity, electron-hole doping asymmetry and "Fermi Surface" topology in cuprates

We investigate the asymmetry between electron and hole doping in a 2D Mott insulator, and the resulting competition between antiferromagnetism (AF) and d-wave superconductivity (SC), using variational Monte Carlo for projected wave functions. We find that key features of the T = 0 phase diagram, such as critical doping for SC-AF coexistence and the maximum value of the SC order parameter, are determined by a single parameter which characterises the topology of the "Fermi surface" at half filling defined by the bare tight-binding parameters. Our results give insight into why AF wins for electron doping, while SC is dominant on the hole doped side. We also suggest using band structure engineering to control the parameter for enhancing SC.Comment: 4 pages, 4 figure

Through-silicon-via management during 3D physical design: When to add and how many?

Abstract — In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger area than regular gates. In this paper, we address two critical aspects of TSV management in 3D designs. First, we address the problem of how many TSVs to add in a design. Since TSVs occupy significant silicon area, a general tendency has been to use a minimum number of TSVs in 3D circuits. We show that such an approach does not give us the best possible result. Second, we address the problem of TSV insertion. Because TSVs occupy silicon area, their location is decided during the placement stage of 3D design. However, we show that this is not the best possible stage for TSV insertion. We propose a change in the physical design flow for 3D integrated circuits to address the limitations of existing TSV placement methodology. All our algorithms are integrated with commercial tools, and our results are validated based on actual GDSII layouts. Our experimental results show the effectiveness of our methods. I

Modeling of electromigration in through-silicon-via based 3D

Abstract Electromigration (EM) is a critical problem for interconnect reliability of modern IC design, especially as the feature size becomes smaller. In 3D IC technology, the EM problem becomes more severe due to drastic dimension mismatches between metal wires, through-silicon-vias (TSVs), and landing pads. Meanwhile, the thermo-mechanical stress due to TSV can further interact with EM and shorten the lifetime of the structure. However, there is very little study on EM issues with respect to TSV for 3D ICs. In this paper, we perform detailed and systematic studies on: (1) EM lifetime modeling of TSV structure, (2) impact of TSV stress on EM lifetime of BEOL wires, and (3) EM-robust design guidelines for TSV-based 3D ICs. Our results show EMinduced lifetime of TSV structure and neighboring wire largely depend on the TSV-induced stress. Also, lifetime of a wire can vary significantly depending on the relative position with the nearby TSV. I. Introduction As semiconductor technologies are pushed forward for higher performance with smaller power and area, threedimensional integrated circuits (3D ICs) have attracted a lot of attention from both academia and industry. 3D ICs can be realized with stacked dies and through-silicon-vias (TSVs) to communicate vertically. 3D ICs can help increase the bandwidth by reducing the interconnect length, reduce the footprint of the system, and achieve heterogeneous integration of the system. However 3D ICs introduce many new challenges, in particular the reliability issues which have become more critical. The temperature characteristics of 3D ICs can be worse, additional stress can be generated due to the coefficient of thermal expansion (CTE) mismatch between TSV and silicon materials, and current density of the interconnects needs to be increased to feed more transistors in spite of high loading capacitance of TSVs. Electromigration (EM) has been one of the major reliability problems even in conventional 2D IC designs. EM refers to the mass transport in metal structures. It is affected by geometrical shapes, temperature distribution, mechanical stress, current density, and material properties However in 3D ICs, despite of importance of EM which can shorten the lifetime of the system, only a few papers have been published regarding this issue. Shayan et al. considered mean time to failure (MTTF) due to the EM based on Black's equation, for a power distribution network (PDN) for 3D IC

Yoga Intervention as a Potential Countermeasure for Polar T3 Syndrome

Polar T3 syndrome is a common ailment for polar sojourners. It is characterised by abnormal fluctuations of thyroid hormones during extended polar winter. A randomised controlled study was conducted on 14 winter expedition members of Indian Scientific Expedition (2016) to Antarctica by introducing customised yoga module. Blood samples were collected during January to October, 2016 at different intervals for the estimation of total thyroxine (TT4), total triiodothyronine (TT3), thyroid stimulating hormone and noradrenaline (NA) by ELISA. In October yoga group showed significant (p = 0.04) higher TT3 values (2.1 ng/ml ± 0.9; mean ± SD) as compared to the control (0.7 ng/ml ± 0.6). In October a significant difference (p=0.0085) was observed between yoga and control group for NA values (47.0 pg/ml ± 22.0 and 107 pg/ml ± 46.0). Thyroid response of control group at the end of the study revealed presence of polar T3 syndrome in control group. Results indicate that regular yoga practice helped mitigating polar T3 syndrom

Countries with high deaths due to flu and tuberculosis demonstrate lower COVID-19 mortality: roles of vaccinations

Deaths due to the ongoing COVID-19 pandemic vary (3–1681 deaths/million and mortality rates 0.71–14.54%) and are far greater in some countries compared to others. This observation led us to perform epidemiological analysis, using data in the public domain, to study the correlation of COVID-19 with the prevalence and vaccination strategies for two respiratory pathogens: flu and tuberculosis (TB). Countries showing more than 1000 COVID-19 deaths were selected at three time points during the ongoing pandemic: 17 May, 1 October and 31 December 2020. The major findings of this study that are broadly consistent at all three time points are: First, countries with high flu deaths negatively correlate with COVID-19 deaths/million. Second, TB incidences and deaths negatively correlate with COVID-19 deaths/million. Countries displaying high TB and flu deaths (Nigeria, Ethiopia, Myanmar, Indonesia, India) display lower COVID-19 deaths/million compared to countries with low TB and flu deaths (Italy, Spain, USA, France). Third, countries with greater flu vaccination display lower flu incidences but higher COVID-19 deaths/million and mortality rates. On the other hand, Bacillus Calmette Guerin (BCG) vaccination negatively correlates with Covid-19 deaths/million. Fourth, countries with only BCG, but no flu, vaccination show delayed and lower number of COVID-19 deaths/million compared to countries with flu, but no BCG, vaccination. Fifth, countries with high BCG vaccination coverage as well as high TB deaths display the lowest COVID-19 deaths/million. The implications of this global study are discussed with respect to the roles of respiratory infections and vaccinations in lowering COVID-19 deaths

Global Routing Paradigm for System-on-Package

The true potential of three dimensional System-On-Package (SOP) technology lies in its capability to integrate both active and passive components into a single high speed/density multi-layer packaging substrate. We propose a new interconnect-centric SOP global routing algorithm that handles arbitrary routing topologies and produces near optimal results. The contribution of this work is threefold: (i) modeling of the SOP routing resource, (ii) formulation of the new SOP global routing problem, and (iii) development of a fast and novel algorithm that considers the various design constraints unique to SOP. Our related experimental results demonstrate the effectiveness of our algorith